Materials for high-density electronic packaging and interconnection : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
1990
TK7870 .N35 1990 (Mapit)
Available at General Collection
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Details
Title
Materials for high-density electronic packaging and interconnection : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Corporate Author
National Research Council (U.S.). Committee on Materials for High- Density Electronic Packaging.
ISBN
030904233X
Publication Details
Washington, D.C. : National Academy Press ; Alexandria, VA : Available from Defense Technical Information Center, Cameron Station, 1990.
Language
English
Description
xiv, 139 p. : ill. ; 28 cm.
Call Number
TK7870 .N35 1990
Dewey Decimal Classification
621.381/046
Note
"NMAB-449."
Bibliography, etc. Note
Includes bibliographical references.
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