Development of sub-mm wave flip-chip interconnect / vorgelegt von M.Sc. Sirinpa Monayakul.
2016
T7 .M663 2016
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Details
Title
Development of sub-mm wave flip-chip interconnect / vorgelegt von M.Sc. Sirinpa Monayakul.
Author
Edition
1. Auflage.
ISBN
9783736994102
9783736984103 (e-book)
9783736984103 (e-book)
Published
Gottingen, [Germany] : Cuvillier Verlag, 2016.
Copyright
©2016
Language
English
Description
1 online resource (142 pages) : illustrations (some color).
Call Number
T7 .M663 2016
Dewey Decimal Classification
600
Bibliography, etc. Note
Includes bibliographical references.
Access Note
Access limited to authorized users.
Source of Description
Description based on online resource; title from PDF title page (ebrary, viewed September 27, 2017).
Series
Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut fur Hochstfrequenztechnik ; Band 38
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