001390325 000__ 02227nam\a22005658i\4500
001390325 001__ 1390325
001390325 003__ DLC
001390325 005__ 20220420003052.0
001390325 006__ m\\\\\o\\d\\\\\\\\
001390325 007__ cr\un\nnnunnun
001390325 008__ 191213s2020\\\\nju\\\\\ob\\\\001\0\eng\d
001390325 010__ $$a  2019057783
001390325 020__ $$a9781119556657$$q(electronic book)
001390325 020__ $$a1119556651
001390325 020__ $$a1119556643
001390325 020__ $$a9781119556671$$q(electronic book)
001390325 020__ $$a1119556678$$q(electronic book)
001390325 020__ $$a9781119556640$$q(electronic book)
001390325 020__ $$z9781119556633
001390325 020__ $$z1119556635
001390325 0247_ $$a10.1002/9781119556671$$2doi
001390325 040__ $$aNhCcYBP$$cNhCcYBP
001390325 042__ $$apcc
001390325 050_4 $$aTK7871.67.M5
001390325 08200 $$a621.382/4$$223
001390325 24500 $$aAntenna-in-package technology and applications /$$cedited by Duixian Liu, Yueping Zhang.
001390325 250__ $$aFirst edition.
001390325 263__ $$a2003
001390325 264_1 $$aHoboken, New Jersey :$$bWiley-IEEE Press,$$c[2020]
001390325 300__ $$a1 online resource.
001390325 336__ $$atext$$btxt$$2rdacontent
001390325 337__ $$acomputer$$bn$$2rdamedia
001390325 338__ $$aonline resource$$bnc$$2rdacarrier
001390325 504__ $$aIncludes bibliographical references and index.
001390325 5050_ $$aAntennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida.
001390325 506__ $$aAccess limited to authorized users
001390325 533__ $$aElectronic reproduction.$$bAnn Arbor, MI$$nAvailable via World Wide Web.
001390325 588__ $$aDescription based on print version record and CIP data provided by publisher; resource not viewed.
001390325 650_0 $$aMicrostrip antennas.
001390325 650_0 $$aMicroelectronic packaging.
001390325 655_0 $$aElectronic books
001390325 7001_ $$aLiu, Duixian,$$eeditor.
001390325 7001_ $$aZhang, Yueping,$$eeditor.
001390325 7102_ $$aProQuest (Firm)
001390325 77608 $$iPrint version:$$tAntenna-in-package technology and applications.$$bFirst edition.$$dHoboken, New Jersey : Wiley-IEEE Press, [2020]$$z9781119556633$$w(DLC)  2019057782
001390325 852__ $$bebk
001390325 85640 $$3GOBI DDA$$uhttps://univsouthin.idm.oclc.org/login?url=https://ebookcentral.proquest.com/lib/usiricelib-ebooks/detail.action?docID=6128722$$zOnline Access
001390325 909CO $$ooai:library.usi.edu:1390325$$pGLOBAL_SET
001390325 980__ $$aBIB
001390325 980__ $$aEBOOK
001390325 982__ $$aEbook
001390325 983__ $$aOnline