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001394647 020__ $$z9781787143951
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001394647 035__ $$a(OCoLC)979152273
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001394647 0820_ $$a621.381046$$223
001394647 24500 $$aIMAPS Poland 2016 /$$cguest editor, Dr. Agata Skwarek.
001394647 264_1 $$a[Bradford, England] :$$bEmerald Publishing Limited,$$c2017.
001394647 264_4 $$c©2017
001394647 300__ $$a1 online resource (69 pages) :$$billustrations, graphs, tables.
001394647 336__ $$atext$$2rdacontent
001394647 337__ $$acomputer$$2rdamedia
001394647 338__ $$aonline resource$$2rdacarrier
001394647 4900_ $$aSoldering & Surface Mount Technology,$$x0954-0911 ;$$vVolume 29, Number 1
001394647 504__ $$aIncudes bibliographical references.
001394647 506__ $$aAccess limited to authorized users.
001394647 588__ $$aDescription based on online resource; title from PDF cover (ebrary, viewed April 3, 2017).
001394647 650_0 $$aMicroelectronic packaging$$vCongresses.
001394647 650_0 $$aInterconnects (Integrated circuit technology)$$vCongresses.
001394647 655_0 $$aElectronic books
001394647 7001_ $$aSkwarek, Agata,$$eeditor.
001394647 77608 $$iPrint version:$$tIMAPS Poland 2016.$$d[Bradford, England] : Emerald Publishing Limited, c2017 $$z9781787143951
001394647 852__ $$bebk
001394647 85640 $$3ProQuest Ebook Central Academic Complete $$uhttps://univsouthin.idm.oclc.org/login?url=https://ebookcentral.proquest.com/lib/usiricelib-ebooks/detail.action?docID=4825319$$zOnline Access
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