TY  - GEN
T1  - Lead-free soldering process development and reliability /
AU  - Bath, Jasbir,
CN  - TK7870.15
ID  - 1403329
KW  - Electronic packaging.
KW  - Solder and soldering.
SN  - 9781119482048 (e-book)
TI  - Lead-free soldering process development and reliability /
LK  - https://univsouthin.idm.oclc.org/login?url=https://ebookcentral.proquest.com/lib/usiricelib-ebooks/detail.action?docID=6229588
UR  - https://univsouthin.idm.oclc.org/login?url=https://ebookcentral.proquest.com/lib/usiricelib-ebooks/detail.action?docID=6229588
ER  -