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001403329 020__ $$z9781119482031
001403329 020__ $$a9781119482048 (e-book)
001403329 035__ $$a(MiAaPQ)EBC6229588
001403329 035__ $$a(Au-PeEL)EBL6229588
001403329 035__ $$a(OCoLC)1159169475
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001403329 050_4 $$aTK7870.15$$b.L433 2020
001403329 0820_ $$a621.381/046$$223
001403329 24500 $$aLead-free soldering process development and reliability /$$cedited by Jasbir Bath.
001403329 264_1 $$aHoboken, New Jersey :$$bWiley,$$c2020.
001403329 300__ $$a1 online resource (515 pages).
001403329 336__ $$atext$$btxt$$2rdacontent
001403329 337__ $$acomputer$$bc$$2rdamedia
001403329 338__ $$aonline resource$$bcr$$2rdacarrier
001403329 4901_ $$aWiley Series in Quality & Reliability Engineering
001403329 504__ $$aIncludes bibliographical references and index.
001403329 506__ $$aAccess limited to authorized users.
001403329 588__ $$aDescription based on print version record.
001403329 650_0 $$aElectronic packaging.
001403329 650_0 $$aSolder and soldering.
001403329 655_0 $$aElectronic books
001403329 7001_ $$aBath, Jasbir,$$eeditor.
001403329 77608 $$iPrint version:$$tLead-free soldering process development and reliability.$$dHoboken, New Jersey : Wiley, 2020 $$z9781119482031 $$w(DLC) 2020004970
001403329 830_0 $$aWiley series in quality & reliability engineering.
001403329 852__ $$bebk
001403329 85640 $$3ProQuest Ebook Central Academic Complete $$uhttps://univsouthin.idm.oclc.org/login?url=https://ebookcentral.proquest.com/lib/usiricelib-ebooks/detail.action?docID=6229588$$zOnline Access
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001403329 980__ $$aBIB
001403329 980__ $$aEBOOK
001403329 982__ $$aEbook
001403329 983__ $$aOnline