TY  - GEN
N2  - This book gathers selected papers presented at the 1st International Conference on Industrial Applications of Adhesives 2020 (IAA 2020). It covers a wide range of topics, including adhesive curing for electronic and automotive industries; adhesive testing with a torsion machine for rigorous mechanical properties determination; joint design using innovative techniques such as the meshless method; design methodologies in the automotive industry for joints under impact; temperature effects in joints typically found in civil engineering; and advanced nondestructive techniques such as terahertz spectroscopy to assess the durability of adhesive joints. Providing a review of the state-of the art in industrial applications of adhesives, the book serves as a valuable reference resource for researchers and graduate students interested in adhesive bonding.
DO  - 10.1007/978-981-15-6767-4.
DO  - doi
AB  - This book gathers selected papers presented at the 1st International Conference on Industrial Applications of Adhesives 2020 (IAA 2020). It covers a wide range of topics, including adhesive curing for electronic and automotive industries; adhesive testing with a torsion machine for rigorous mechanical properties determination; joint design using innovative techniques such as the meshless method; design methodologies in the automotive industry for joints under impact; temperature effects in joints typically found in civil engineering; and advanced nondestructive techniques such as terahertz spectroscopy to assess the durability of adhesive joints. Providing a review of the state-of the art in industrial applications of adhesives, the book serves as a valuable reference resource for researchers and graduate students interested in adhesive bonding.
T1  - Industrial applications of adhesives :1st International Conference on Industrial Applications of Adhesives /
DA  - [2021]
CY  - Singapore :
AU  - Silva, Lucas F. M. da.
AU  - Adams, Robert D.
AU  - Sato, Chiaki.
AU  - Dilger, Klaus.
CN  - TP967
PB  - Springer,
PP  - Singapore :
PY  - [2021]
N1  - International conference proceedings.
ID  - 1431685
KW  - Adhesives
KW  - Adhésifs
SN  - 9789811567674
SN  - 9811567670
TI  - Industrial applications of adhesives :1st International Conference on Industrial Applications of Adhesives /
LK  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-981-15-6767-4
UR  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-981-15-6767-4
ER  -