Design and crosstalk analysis in carbon nanotube interconnects / P. Uma Sathyakam, Partha Sharathi Mallick.
Sathyakam, P. Uma.; Mallick, Partha Sharathi, author.
2021
TK7874.53
Available Online

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Title Design and crosstalk analysis in carbon nanotube interconnects / P. Uma Sathyakam, Partha Sharathi Mallick.
Author Sathyakam, P. Uma.
ISBN 9789811588884 (electronic bk.)
9811588880 (electronic bk.)
9811588872
9789811588877
DOI https://doi.org/10.1007/978-981-15-8888-4
Publication Details Singapore : Springer, 2021.
Language English
Description 1 online resource
Item Number 10.1007/978-981-15-8888-4 doi
Call Number TK7874.53
Dewey Decimal Classification 621.3815
Summary This book provides a single-source reference on carbon nanotubes for interconnect applications. It presents the recent advances in modelling and challenges of carbon nanotube (CNT)-based VLSI interconnects. Starting with a background of carbon nanotubes and interconnects, this book details various aspects of CNT interconnect models, the design metrics of CNT interconnects, crosstalk analysis of recently proposed CNT interconnect structures, and geometries. Various topics covered include the use of semiconducting CNTs around metallic CNTs, CNT interconnects with air gaps, use of emerging ultra low-k materials and their integration with CNT interconnects, and geometry-based crosstalk reduction techniques. This book will be useful for researchers and design engineers working on carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Bibliography, etc. Note Includes bibliographical references.
Access Note Access limited to authorized users.
Digital File Characteristics text file
PDF
Source of Description Online resource; title from PDF title page (SpringerLink, viewed January 19, 2021).
Added Author Mallick, Partha Sharathi, author.
Available in Other Form Print version: 9789811588877
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Record Appears in Online Resources > Ebooks
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Introduction
Background and Literature Review
Reducing Crosstalk in CNT Interconnects
Reducing Crosstalk using Ultra-low-k Dielectrics in CNT Interconnects
Reducing Crosstalk using Air-gaps
Thermal Analysis of CNT Interconnects
Modelling of High Speed CNT Interconnects under Subthreshold Conditions
Conclusions and Future Work.

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