3D microelectronic packaging : from architectures to applications / Yan Li, Deepak Goyal, editors.
Li, Yan, editor.; Goyal, Deepak (Electrical engineer), editor.
2021
TK7874 .T57 2021
Available Online

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Title 3D microelectronic packaging : from architectures to applications / Yan Li, Deepak Goyal, editors.
Edition Second edition.
ISBN 9789811570902 (electronic book)
9811570906 (electronic book)
9789811570896
DOI https://doi.org/10.1007/978-981-15-7090-2
Published Singapore : Springer, [2021]
Language English
Description 1 online resource
Other Standard Identifiers 10.1007/978-981-15-7090-2 doi
Call Number TK7874 .T57 2021
Dewey Decimal Classification 621.3815
Summary This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Bibliography, etc. Note Includes bibliographical references and index.
Access Note Access limited to authorized users.
Digital File Characteristics text file
PDF
Source of Description Online resource; title from digital title page (viewed on February 02, 2021).
Added Author Li, Yan, editor.
Goyal, Deepak (Electrical engineer), editor.
Series Springer series in advanced microelectronics ; 64. 1437-0387
Available in Other Form Print version: 9789811570896
Print version: 9789811570919
Print version: 9789811570926
Linked Resources Online Access
Record Appears in Online Resources > Ebooks
All Resources
1. Introduction to 3D microelectronic packaging
2. 3D packaging architecture and assembly process design
3. Fundamentals of TSV processing and reliability
4. Mechanical properties of TSV
5. Atomistic View of TSV Protrusion/Intrusion
6. Fundamentals and failures in Die preparation for 3D packaging
7. Direct Cu to Cu bonding and other alternative interconnects in 3D packaging
8. Emerging hybrid bonding techniques for 3D packaging
9. Fundamental of Thermal Compressive Bonding process, advanced epoxy, and flux materials in 3D packaging
10. Fundamentals of solder alloys in 3D packaging
11. Fundamentals of electro migration in interconnects of 3D packages
12. Fundamentals of heat dissipation in 3D packaging
13. Fundamentals of advanced materials and process in substrate technology
14. New substrate technologies for 3D packaging.-15. Thermal mechanical and moisture modeling in 3D packaging
16. Stress and Strain measurements in 3D packaging
17. Processing and Reliability of Solder Interconnections in Stacked Packaging
18. Interconnect Quality and Reliability of 3D Packaging
19. Fundamentals of automotive reliability of 3D packages
20. Fault isolation and failure analysis of 3D packaging.

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