001433250 000__ 04820cam\a2200745\i\4500
001433250 001__ 1433250
001433250 003__ OCoLC
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001433250 019__ $$a1224370547$$a1237463113$$a1238203437$$a1241066621$$a1249943768$$a1311413669
001433250 020__ $$a9789811570902$$q(electronic book)
001433250 020__ $$a9811570906$$q(electronic book)
001433250 020__ $$z9789811570896
001433250 0247_ $$a10.1007/978-981-15-7090-2$$2doi
001433250 035__ $$aSP(OCoLC)1228845681
001433250 040__ $$aUPM$$beng$$erda$$epn$$cUPM$$dOCLCO$$dOCLCQ$$dGW5XE$$dYDXIT$$dEBLCP$$dDCT$$dLEATE$$dOCLCO$$dOCLCQ$$dOCLCO$$dCOM$$dN$T$$dOCLCQ
001433250 049__ $$aISEA
001433250 050_4 $$aTK7874$$b.T57 2021
001433250 08204 $$a621.3815$$223
001433250 24500 $$a3D microelectronic packaging :$$bfrom architectures to applications /$$cYan Li, Deepak Goyal, editors.
001433250 2463_ $$aThree Dimensional microelectronic packaging
001433250 250__ $$aSecond edition.
001433250 264_1 $$aSingapore :$$bSpringer,$$c[2021]
001433250 300__ $$a1 online resource
001433250 336__ $$atext$$btxt$$2rdacontent
001433250 337__ $$acomputer$$bc$$2rdamedia
001433250 338__ $$aonline resource$$bcr$$2rdacarrier
001433250 347__ $$atext file
001433250 347__ $$bPDF
001433250 4901_ $$aSpringer series in advanced microelectronics,$$x1437-0387 ;$$vvolume 64
001433250 504__ $$aIncludes bibliographical references and index.
001433250 5050_ $$a1. Introduction to 3D microelectronic packaging -- 2. 3D packaging architecture and assembly process design -- 3. Fundamentals of TSV processing and reliability -- 4. Mechanical properties of TSV -- 5. Atomistic View of TSV Protrusion/Intrusion -- 6. Fundamentals and failures in Die preparation for 3D packaging -- 7. Direct Cu to Cu bonding and other alternative interconnects in 3D packaging -- 8. Emerging hybrid bonding techniques for 3D packaging -- 9. Fundamental of Thermal Compressive Bonding process, advanced epoxy, and flux materials in 3D packaging -- 10. Fundamentals of solder alloys in 3D packaging -- 11. Fundamentals of electro migration in interconnects of 3D packages -- 12. Fundamentals of heat dissipation in 3D packaging -- 13. Fundamentals of advanced materials and process in substrate technology -- 14. New substrate technologies for 3D packaging.-15. Thermal mechanical and moisture modeling in 3D packaging -- 16. Stress and Strain measurements in 3D packaging -- 17. Processing and Reliability of Solder Interconnections in Stacked Packaging -- 18. Interconnect Quality and Reliability of 3D Packaging -- 19. Fundamentals of automotive reliability of 3D packages -- 20. Fault isolation and failure analysis of 3D packaging.
001433250 506__ $$aAccess limited to authorized users.
001433250 520__ $$aThis book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
001433250 588__ $$aOnline resource; title from digital title page (viewed on February 02, 2021).
001433250 650_0 $$aMicroelectronics$$xPackaging.
001433250 650_0 $$aElectronic circuits.
001433250 650_0 $$aElectronics.
001433250 650_0 $$aOptical materials.
001433250 650_0 $$aElectronics$$xMaterials.
001433250 650_0 $$aBiotechnology.
001433250 650_0 $$aNanotechnology.
001433250 650_0 $$aMetals.
001433250 650_6 $$aMicroélectronique$$xConditionnement.
001433250 650_6 $$aCircuits électroniques.
001433250 650_6 $$aÉlectronique.
001433250 650_6 $$aMatériaux optiques.
001433250 650_6 $$aÉlectronique$$xMatériaux.
001433250 650_6 $$aBiotechnologie.
001433250 650_6 $$aMétaux.
001433250 655_0 $$aElectronic books.
001433250 7001_ $$aLi, Yan,$$eeditor.
001433250 7001_ $$aGoyal, Deepak$$c(Electrical engineer),$$eeditor.
001433250 77608 $$iPrint version: $$z9789811570896
001433250 77608 $$iPrint version: $$z9789811570919
001433250 77608 $$iPrint version: $$z9789811570926
001433250 830_0 $$aSpringer series in advanced microelectronics ;$$v64.$$x1437-0387
001433250 852__ $$bebk
001433250 85640 $$3Springer Nature$$uhttps://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-981-15-7090-2$$zOnline Access$$91397441.1
001433250 909CO $$ooai:library.usi.edu:1433250$$pGLOBAL_SET
001433250 980__ $$aBIB
001433250 980__ $$aEBOOK
001433250 982__ $$aEbook
001433250 983__ $$aOnline
001433250 994__ $$a92$$bISE