Advances in condition monitoring and structural health monitoring : WCCM 2019 / Len Gelman, Nadine Martin, Andrew A. Malcolm, Chin Kian (Edmund) Liew, editors.
2021
TA645
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Title
Advances in condition monitoring and structural health monitoring : WCCM 2019 / Len Gelman, Nadine Martin, Andrew A. Malcolm, Chin Kian (Edmund) Liew, editors.
ISBN
9789811591990 (electronic bk.)
9811591997 (electronic bk.)
9789811591983
9811591989
9811591997 (electronic bk.)
9789811591983
9811591989
Publication Details
Singapore : Springer, 2021.
Language
English
Description
1 online resource (759 pages)
Item Number
10.1007/978-981-15-9199-0 doi
Call Number
TA645
Dewey Decimal Classification
624.1/7
Summary
This book comprises the selected contributions from the 2nd World Congress on Condition Monitoring (WCCM 2019), held in Singapore in December 2019. The contents focus on digitalisation for condition monitoring with the emergence of the fourth industrial revolution (Industry 4.0) and the Industrial Internet-of-Things (IIoT). The book covers latest research findings in the areas of condition monitoring, structural health monitoring, and non-destructive testing which are relevant for many sectors including aerospace, automotive, civil, oil and gas, marine, and manufacturing industries. Different monitoring systems and non-destructive testing methods are discussed to avoid failures, increase lifespans, and reduce maintenance costs of equipment and machinery. The broad scope of the contents will make this book interesting for academics and professionals working in the areas of non-destructive evaluation and condition monitoring.
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Access limited to authorized users.
Digital File Characteristics
text file
PDF
Source of Description
Online resource; title from PDF title page (SpringerLink, viewed March 15, 2021).
Series
Lecture notes in mechanical engineering.
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Table of Contents
1. Condition monitoring
2. Structural health monitoring
3. Non-destructive testing and evaluation.
2. Structural health monitoring
3. Non-destructive testing and evaluation.