Nano-bio-electronic, photonic and MEMS packaging / C.P. (Ching-Ping) Wong, Kyoung-sik (Jack) Moon, editors.
Wong, C. P., 1947-; Moon, Kyoung-Sik.; Li, Yi.
2021
TA418.9.N35 N26 2021eb
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Title Nano-bio-electronic, photonic and MEMS packaging / C.P. (Ching-Ping) Wong, Kyoung-sik (Jack) Moon, editors.
Edition 2nd edition
ISBN 9783030499914 (electronic bk.)
303049991X (electronic bk.)
9783030499921 (print)
3030499928
9783030499938 (print)
3030499936
9783030499907 (print)
3030499901
DOI https://doi.org/10.1007/978-3-030-49991-4
Published Cham : Springer, 2021.
Copyright ©2021
Language English
Description 1 online resource (xiii, 570 pages)
Other Standard Identifiers 10.1007/978-3-030-49991-4 doi
Call Number TA418.9.N35 N26 2021eb
Dewey Decimal Classification 621.381/046
Summary This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.
Note Includes index.
Access Note Access limited to authorized users.
Digital File Characteristics text file
PDF
Source of Description Description based on print version record.
Added Author Wong, C. P., 1947-
Moon, Kyoung-Sik.
Li, Yi.
Available in Other Form Nano-Bio- Electronic, Photonic and MEMS Packaging.
Linked Resources Online Access
Record Appears in Online Resources > Ebooks
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Part I. Electronics (Electrical Interconnections and Thermal Management)
Some Nanomaterials for Microelectronics and Photonics Packaging
Nano-conductive Adhesives for Nano-electronics Interconnection
Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials
Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation and Their Electronic Applications
Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging
Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials
Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation and Their Electronic Applications
Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging
Introduction to Nanoparticle-Based Integrated Passives
Thermally Conductive Nanocomposites
Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension
On-Chip Thermal Management and Hot-Spot Remediation
Some Aspects of Microchannel Heat Transfer
Part II. BioMEMs Packaging
Nanoprobes for Live-Cell Gene Detection
Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips
Packaging of Biomolecular and Chemical Microsensors
Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging
Biomimetic Lotus Effect Surfaces for Nanopackaging
Part III. Wearable Devices Packaging and Materials
Soft Material-Enabled Packaging for Stretchable and Flexible Hybrid Electronics
Part IV. Biomedical Devices Packaging
Evolution of advanced miniaturization for active implantable medical devices
Part V. Optical Device Packaging
An Introduction of the Phosphor-Converted White LED Packaging and Its Reliability
Part VI. Energy harvesting
Mechanical Energy Harvesting Using Wurtzite Nanowires
1D Nanowire Electrode Materials for Power Sources of Microelectronics
Part VII. Energy Storage (LIB Battery)
Graphene-Based Materials with Tailored Nanostructures for Lithium-Ion Batteries
Part VIII. Energy Storage (Supercapacitor)
Fe-Based Anode Materials for Asymmetric Supercapacitors
Part IX. Metrology
Nanoscale Deformation and Strain Analysis by AFM-DIC Technique
Part X. Computational
Molecular Dynamics Applications in Packaging
Nano-scale and Atomistic-Scale Modeling of Advanced Materials.

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