TY  - GEN
N2  - The book presents high-quality papers from the Fourth International Conference on Microelectronics and Telecommunication Engineering (ICMETE 2021). It discusses the latest technological trends and advances in major research areas such as microelectronics, wireless communications, optical communication, signal processing, image processing, big data, cloud computing, artificial intelligence and sensor network applications. This book includes the contributions of national and international scientists, researchers, and engineers from both academia and the industry. The contents of this volume will be useful to researchers, professionals, and students alike.
DO  - 10.1007/978-981-16-8721-1
DO  - doi
AB  - The book presents high-quality papers from the Fourth International Conference on Microelectronics and Telecommunication Engineering (ICMETE 2021). It discusses the latest technological trends and advances in major research areas such as microelectronics, wireless communications, optical communication, signal processing, image processing, big data, cloud computing, artificial intelligence and sensor network applications. This book includes the contributions of national and international scientists, researchers, and engineers from both academia and the industry. The contents of this volume will be useful to researchers, professionals, and students alike.
T1  - Micro-electronics and telecommunication engineering :proceedings of 5th ICMETE 2021 /
AU  - Sharma, Devendra Kumar,
AU  - Peng, Sheng-Lung,
AU  - Sharma, Rohit
AU  - Zaitsev, Dmitry A.,
VL  - volume 373
CN  - TK7874
N1  - International conference proceedings.
N1  - Includes author index.
ID  - 1444734
KW  - Microelectronics
KW  - Telecommunication
KW  - Microélectronique
KW  - Télécommunications
SN  - 9789811687211
SN  - 9811687218
TI  - Micro-electronics and telecommunication engineering :proceedings of 5th ICMETE 2021 /
LK  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-981-16-8721-1
UR  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-981-16-8721-1
ER  -