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001444832 001__ 1444832
001444832 003__ OCoLC
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001444832 019__ $$a1302001830$$a1302009243$$a1302103348$$a1302117340$$a1302177843
001444832 020__ $$a9783030934415$$q(electronic bk.)
001444832 020__ $$a3030934411$$q(electronic bk.)
001444832 020__ $$z9783030934408
001444832 020__ $$z3030934403
001444832 0247_ $$a10.1007/978-3-030-93441-5$$2doi
001444832 035__ $$aSP(OCoLC)1301946104
001444832 040__ $$aYDX$$beng$$erda$$epn$$cYDX$$dGW5XE$$dEBLCP$$dOCLCO$$dOCLCF$$dOCLCO$$dUKAHL$$dOCLCQ
001444832 049__ $$aISEA
001444832 050_4 $$aTS610
001444832 08204 $$a671.5/6$$223
001444832 24500 $$aRecent progress in lead-free solder technology :$$bmaterials development, processing and performances /$$cMohd Arif Anuar Mohd Salleh, Mohd Sharizal Abdul Aziz, Azman Jalar, Mohd Izrul Izwan Ramli, editors.
001444832 264_1 $$aCham :$$bSpringer,$$c[2022]
001444832 264_4 $$c©2022
001444832 300__ $$a1 online resource :$$billustrations (chiefly color).
001444832 336__ $$atext$$btxt$$2rdacontent
001444832 337__ $$acomputer$$bc$$2rdamedia
001444832 338__ $$aonline resource$$bcr$$2rdacarrier
001444832 4901_ $$aTopics in mining, metallurgy and materials engineering
001444832 5050_ $$aRecent Studies in The Development of Ceramic Reinforced Lead-Free Composite Solder -- Development of Geopolymer Ceramic Reinforced Solder -- Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders -- Molecular Dynamic on the Nanoparticle Reinforcement into Lead-free Solder during Reflow Soldering Process -- Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics -- Advanced assembly of Miniaturized Surface Mount Technology Components using Nano-Reinforced Solder Paste -- Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi -- The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation & Experimental -- Flux Modification for Wettability and Reliability Improvement in Solder Joints -- Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints -- Significance of Interfacial Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint and Methods of IMC Layer Thickness Measurements -- The Effect of Laser Soldering onto Intermetallic Compound Formation and Growth -- Reliability Analysis on the Flexible Printed Circuit Board During Reflow Soldering -- Solder Pastes Rheology Data for Stencil Printing Numerical Investigations -- Tin Whiskers Growth in Electronic Assemblies.
001444832 506__ $$aAccess limited to authorized users.
001444832 520__ $$aThis book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
001444832 588__ $$aOnline resource; title from PDF title page (SpringerLink, viewed March 11, 2022).
001444832 650_0 $$aSolder and soldering$$xTechnological innovations.
001444832 650_0 $$aLead-free electronics manufacturing processes.
001444832 650_6 $$aSoudure$$xInnovations.
001444832 655_0 $$aElectronic books.
001444832 7000_ $$aMohd Arif Anuar Mohd Salleh,$$eeditor.
001444832 7001_ $$aAbdul Aziz, Mohd Sharizal,$$eeditor.
001444832 7001_ $$aJalar, Azman,$$eeditor.
001444832 7001_ $$aIzwan Ramli, Mohd Izrul,$$eeditor.
001444832 77608 $$iPrint version: $$z3030934403$$z9783030934408$$w(OCoLC)1286145775
001444832 830_0 $$aTopics in mining, metallurgy and materials engineering.
001444832 852__ $$bebk
001444832 85640 $$3Springer Nature$$uhttps://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-3-030-93441-5$$zOnline Access$$91397441.1
001444832 909CO $$ooai:library.usi.edu:1444832$$pGLOBAL_SET
001444832 980__ $$aBIB
001444832 980__ $$aEBOOK
001444832 982__ $$aEbook
001444832 983__ $$aOnline
001444832 994__ $$a92$$bISE