001445880 000__ 03984cam\a2200541Ii\4500
001445880 001__ 1445880
001445880 003__ OCoLC
001445880 005__ 20230310003855.0
001445880 006__ m\\\\\o\\d\\\\\\\\
001445880 007__ cr\un\nnnunnun
001445880 008__ 220413s2022\\\\si\a\\\\ob\\\\000\0\eng\d
001445880 020__ $$a9789811698248$$q(electronic bk.)
001445880 020__ $$a9811698244$$q(electronic bk.)
001445880 020__ $$z9789811698231
001445880 020__ $$z9811698236
001445880 0247_ $$a10.1007/978-981-16-9824-8$$2doi
001445880 035__ $$aSP(OCoLC)1310619878
001445880 040__ $$aYDX$$beng$$erda$$epn$$cYDX$$dGW5XE$$dEBLCP$$dOCLCO$$dOCLCF$$dUKAHL$$dN$T$$dOCLCQ
001445880 049__ $$aISEA
001445880 050_4 $$aTK7870$$b.T56 2022
001445880 08204 $$a621.381$$223
001445880 1001_ $$aThomas, Oommen Tharakan Kuttiyil,$$eauthor.
001445880 24510 $$aElectronics production defects and analysis /$$cOommen Tharakan Kuttiyil Thomas, Padma Padmanabhan Gopalan.
001445880 264_1 $$aSingapore :$$bSpringer,$$c[2022]
001445880 264_4 $$c©2022
001445880 300__ $$a1 online resource :$$billustrations (chiefly color).
001445880 336__ $$atext$$btxt$$2rdacontent
001445880 337__ $$acomputer$$bc$$2rdamedia
001445880 338__ $$aonline resource$$bcr$$2rdacarrier
001445880 4901_ $$aSpringer tracts in electrical and electronics engineering
001445880 504__ $$aIncludes bibliographical references.
001445880 5050_ $$aChapter 1: Introduction -- Chapter 2: Soldering Defects -- Chapter 3: PCB Defects -- Chapter 4: Mounting Defects -- Chapter 5: Conformal Coating and Potting Defects -- Chapter 6: EEE Component Defects -- Chapter 7: Workmanship Defects -- Chapter 8: Defects due to the usage of Non-FFF Components -- Chapter 9: Defects in CAD Layout.
001445880 506__ $$aAccess limited to authorized users.
001445880 520__ $$aThis book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter "mounting defects" shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students.
001445880 588__ $$aOnline resource; title from PDF title page (SpringerLink, viewed April 13, 2022).
001445880 650_0 $$aElectronic apparatus and appliances$$xDesign and construction.
001445880 650_0 $$aElectronic apparatus and appliances$$xDefects.
001445880 650_6 $$aAppareils électroniques$$xConception et construction.
001445880 655_0 $$aElectronic books.
001445880 7001_ $$aGopalan, Padma Padmanabhan,$$eauthor.
001445880 77608 $$iPrint version:$$z9811698236$$z9789811698231$$w(OCoLC)1290429482
001445880 830_0 $$aSpringer tracts in electrical and electronics engineering.
001445880 852__ $$bebk
001445880 85640 $$3Springer Nature$$uhttps://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-981-16-9824-8$$zOnline Access$$91397441.1
001445880 909CO $$ooai:library.usi.edu:1445880$$pGLOBAL_SET
001445880 980__ $$aBIB
001445880 980__ $$aEBOOK
001445880 982__ $$aEbook
001445880 983__ $$aOnline
001445880 994__ $$a92$$bISE