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Title
Silicon sensors and actuators : the Feynman roadmap / Benedetto Vigna, Paolo Ferrari, Flavio Francesco Villa, Ernesto Lasalandra, Sarah Zerbini, editors.
ISBN
9783030801359 (electronic bk.)
3030801357 (electronic bk.)
9783030801342 (print)
3030801349
Published
Cham, Switzerland : Springer, 2022.
Language
English
Description
1 online resource (xiii, 997 pages) : illustrations (some color)
Other Standard Identifiers
10.1007/978-3-030-80135-9 doi
Call Number
TK7871.86
Dewey Decimal Classification
621.3815/22
Summary
This book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses emerging and future technology challenges. Readers will acquire a solid theoretical and practical background that will allow them to analyze the key performance aspects of devices, critically judge a fabrication process, and then conceive and design new ones for future applications. Envisioning a future complex versatile microsystem, the authors take inspiration from Richard Feynman's visionary talk "There is Plenty of Room at the Bottom" to propose that the time has come to see silicon sensors as part of a "Feynman Roadmap" instead of the "More-than-Moore" technology roadmap. The sharing of the author's industrially proven track record of development, design, and manufacturing, along with their visionary approach to the technology, will allow readers to jump ahead in their understanding of the core of the topic in a very effective way. Students, researchers, engineers, and technologists involved in silicon-based sensor and actuator research and development will find a wealth of useful and groundbreaking information in this book.
Note
Includes index.
Access Note
Access limited to authorized users.
Source of Description
Online resource; title from PDF title page (SpringerLink, viewed April 20, 2022).
Available in Other Form
Print version: 9783030801342
1. Silicon as Sensor Material
2. Epitaxial Growth
3. Thin Film Deposition
4. Thin Films Characterization & Metrology
5. Dry silicon etch
6. Lithography
7. HF Release
8. Galvanic growth
9. Wet Etch and Cleaning
10. Piezoelectric materials
11. Wafer to wafer Bonding.-12. Linear and non linear mechanichs in MEMS
13. Inertial sensors
14. Magnetometer
15. MEMS microphones
16. Pressure Sensors
17. Enviromental Sensors
18. Mirror
19. Piezo ink jet printers
20. Speakers
21. Autofocus
22. Electronic sensors front-end
23. Electronic Interfaces for actuators
24. Package
25. Testing
26. Reliability
27. The future of sensor and actuators.
