001446025 000__ 03935cam\a2200565Ii\4500
001446025 001__ 1446025
001446025 003__ OCoLC
001446025 005__ 20230310003934.0
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001446025 019__ $$a1311075693$$a1311160110$$a1311235900$$a1311267273$$a1311319470$$a1311361437
001446025 020__ $$a9783030801359$$q(electronic bk.)
001446025 020__ $$a3030801357$$q(electronic bk.)
001446025 020__ $$z9783030801342$$q(print)
001446025 020__ $$z3030801349
001446025 0247_ $$a10.1007/978-3-030-80135-9$$2doi
001446025 035__ $$aSP(OCoLC)1311487569
001446025 040__ $$aGW5XE$$beng$$erda$$epn$$cGW5XE$$dYDX$$dEBLCP$$dOCLCO$$dOCLCF$$dUKAHL$$dOCLCQ
001446025 049__ $$aISEA
001446025 050_4 $$aTK7871.86
001446025 08204 $$a621.3815/22$$223/eng/20220420
001446025 24500 $$aSilicon sensors and actuators :$$bthe Feynman roadmap /$$cBenedetto Vigna, Paolo Ferrari, Flavio Francesco Villa, Ernesto Lasalandra, Sarah Zerbini, editors.
001446025 264_1 $$aCham, Switzerland :$$bSpringer,$$c2022.
001446025 300__ $$a1 online resource (xiii, 997 pages) :$$billustrations (some color)
001446025 336__ $$atext$$btxt$$2rdacontent
001446025 337__ $$acomputer$$bc$$2rdamedia
001446025 338__ $$aonline resource$$bcr$$2rdacarrier
001446025 500__ $$aIncludes index.
001446025 5050_ $$a1. Silicon as Sensor Material -- 2. Epitaxial Growth -- 3. Thin Film Deposition -- 4. Thin Films Characterization & Metrology -- 5. Dry silicon etch -- 6. Lithography -- 7. HF Release -- 8. Galvanic growth -- 9. Wet Etch and Cleaning -- 10. Piezoelectric materials -- 11. Wafer to wafer Bonding.-12. Linear and non linear mechanichs in MEMS -- 13. Inertial sensors -- 14. Magnetometer -- 15. MEMS microphones -- 16. Pressure Sensors -- 17. Enviromental Sensors -- 18. Mirror -- 19. Piezo ink jet printers -- 20. Speakers -- 21. Autofocus -- 22. Electronic sensors front-end -- 23. Electronic Interfaces for actuators -- 24. Package -- 25. Testing -- 26. Reliability -- 27. The future of sensor and actuators.
001446025 506__ $$aAccess limited to authorized users.
001446025 520__ $$aThis book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses emerging and future technology challenges. Readers will acquire a solid theoretical and practical background that will allow them to analyze the key performance aspects of devices, critically judge a fabrication process, and then conceive and design new ones for future applications. Envisioning a future complex versatile microsystem, the authors take inspiration from Richard Feynman's visionary talk "There is Plenty of Room at the Bottom" to propose that the time has come to see silicon sensors as part of a "Feynman Roadmap" instead of the "More-than-Moore" technology roadmap. The sharing of the author's industrially proven track record of development, design, and manufacturing, along with their visionary approach to the technology, will allow readers to jump ahead in their understanding of the core of the topic in a very effective way. Students, researchers, engineers, and technologists involved in silicon-based sensor and actuator research and development will find a wealth of useful and groundbreaking information in this book.
001446025 588__ $$aOnline resource; title from PDF title page (SpringerLink, viewed April 20, 2022).
001446025 650_0 $$aSilicon diodes.
001446025 650_0 $$aActuators.
001446025 650_6 $$aDiodes au silicium.
001446025 650_6 $$aActionneurs.
001446025 655_0 $$aElectronic books.
001446025 7001_ $$aVigna, Benedetto,$$eeditor.
001446025 7001_ $$aFerrari, Paolo,$$eeditor.
001446025 7001_ $$aVilla, Flavio Francesco,$$eeditor.
001446025 7001_ $$aLasalandra, Ernesto,$$eeditor.
001446025 7001_ $$aZerbini, Sarah,$$eeditor.
001446025 77608 $$iPrint version: $$z3030801349$$z9783030801342$$w(OCoLC)1253473830
001446025 852__ $$bebk
001446025 85640 $$3Springer Nature$$uhttps://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-3-030-80135-9$$zOnline Access$$91397441.1
001446025 909CO $$ooai:library.usi.edu:1446025$$pGLOBAL_SET
001446025 980__ $$aBIB
001446025 980__ $$aEBOOK
001446025 982__ $$aEbook
001446025 983__ $$aOnline
001446025 994__ $$a92$$bISE