TY  - GEN
AB  - This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2021), held in Bhubaneswar, Odisha, India during 27-28 August 2021. The papers were written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today's society.
AU  - Chakravarthy, V. V. S. S. Sameer,
AU  - Flores-Fuentes, Wendy,
AU  - Bhateja, Vikrant,
AU  - Biswal, B. N.
CN  - TK7874
DO  - 10.1007/978-981-16-8550-7
DO  - doi
ID  - 1446155
KW  - Microelectronics
KW  - Electromagnetism
KW  - Internet of things
KW  - Microélectronique
KW  - Électromagnétisme
KW  - Internet des objets
LK  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-981-16-8550-7
N1  - Includes author index.
N2  - This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2021), held in Bhubaneswar, Odisha, India during 27-28 August 2021. The papers were written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today's society.
SN  - 9789811685507
SN  - 9811685509
T1  - Advances in micro-electronics, embedded systems and IoT :proceedings of sixth International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2021).
TI  - Advances in micro-electronics, embedded systems and IoT :proceedings of sixth International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2021).
UR  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-981-16-8550-7
VL  - volume 838
ER  -