Go to main content

MicroSystem based on SiP technology / Suny Li, editor.

Li, Suny, 1974- editor.
2022
TK7874
Available Online
Formats
Format
BibTeX
MARCXML
TextMARC
MARC
DublinCore
EndNote
NLM
RefWorks
RIS
Add to Basket
Cite
Citation

Linked e-resources

Linked Resource
Online Access
Concurrent users
Unlimited
Authorized users
Authorized users
Document Delivery Supplied
Can lend chapters, not whole ebooks

Details

Title
MicroSystem based on SiP technology / Suny Li, editor.
ISBN
9789811900839 (electronic bk.)
9811900833 (electronic bk.)
9789811900822
9811900825
DOI
https://doi.org/10.1007/978-981-19-0083-9
Published
Singapore : Springer, 2022.
Language
English
Description
1 online resource (xviii, 874 pages) : illustrations (some color)
Item Number
10.1007/978-981-19-0083-9 doi
Call Number
TK7874
Dewey Decimal Classification
621.3815
Summary
This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si3P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
Bibliography, etc. Note
Includes bibliographical references.
Access Note
Access limited to authorized users.
Source of Description
Online resource; title from PDF title page (SpringerLink, viewed June 6, 2022).
Added Author
Li, Suny, 1974- editor.
Available in Other Form
MicroSystem Based on SiP Technology
Linked Resources
Online Access
Record Appears in
Online Resources > Ebooks
All Resources
From Moore's law to Function Density Law
From SiP to Si3P
SiP Technology and MicroSystem
From 2D to 4D Integration
SiP and Advanced Packaging Technology
SiP Design, Simulation and Verification Platform
Establishment and Management of Central Library
SiP Schematic Design Input
Creation and Setting of Layout
Management of Design Rules
Wire Bonding Design in Detail
Cavity, Chip Stack and TSV design
RDL and Flip Chip Design
Layout Route and Plane
Embedded Passive Design
RF Circuit Design
Rigid-Flex Circuits and 4D SiP Design
Multi-Layout Project and Concurrent DesignSiP Design Flow Based on Advanced Package (HDAP)
Design Review and Production Data Output
SiP Simulation and Verification Technology
Large Capacity Storage SiP Design Case
SiP Project Planning and Design Case
2.5D TSV Technology and Design Case
Digital T/R Module SiP Design Case
MEMS Verification SiP Design Case
Rigid-Flex SiP Design Case
RF System Integrated SiP Design Case
PoP RF SiP Design Case
SiP Production Data Processing Case.

Browse Subjects

Show more subjects...

Statistics

from
to
Export