TY  - GEN
N2  - This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrows 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs. Addresses modeling and optimization of (heterogenous) 3D interconnect architectures from the physical to system level; Provides several optimization techniques for all key 3D-interconnect metrics; Presents the only open-source NoC simulator for heterogenous 3D SoCs.
DO  - 10.1007/978-3-030-98229-4
DO  - doi
AB  - This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrows 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs. Addresses modeling and optimization of (heterogenous) 3D interconnect architectures from the physical to system level; Provides several optimization techniques for all key 3D-interconnect metrics; Presents the only open-source NoC simulator for heterogenous 3D SoCs.
T1  - 3D interconnect architectures for heterogeneous technologies :modeling and optimization /
AU  - Bamberg, Lennart.
AU  - Joseph, Jan Moritz.
AU  - García-Ortiz, Alberto.
AU  - Pionteck, Thilo.
CN  - TK7874.53
ID  - 1447946
KW  - Interconnects (Integrated circuit technology)
KW  - Systems on a chip.
SN  - 9783030982294
SN  - 3030982297
TI  - 3D interconnect architectures for heterogeneous technologies :modeling and optimization /
LK  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-3-030-98229-4
UR  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-3-030-98229-4
ER  -