TY  - GEN
N2  - This book constitutes the proceedings of the 22st International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation, SAMOS 2021, which took place in July 2022 in Samos, Greece. The 21 full papers presented in this volume were carefully reviewed and selected from 44 submissions. The papers are organized in topics as follows: High level synthesis; memory systems; processor architecture; embedded software systems and beyond; deep learning optimization; extra-functional property estimation; innovative architectures and tools for security; european research projects on digital systems, services, and platforms.
DO  - 10.1007/978-3-031-15074-6
DO  - doi
AB  - This book constitutes the proceedings of the 22st International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation, SAMOS 2021, which took place in July 2022 in Samos, Greece. The 21 full papers presented in this volume were carefully reviewed and selected from 44 submissions. The papers are organized in topics as follows: High level synthesis; memory systems; processor architecture; embedded software systems and beyond; deep learning optimization; extra-functional property estimation; innovative architectures and tools for security; european research projects on digital systems, services, and platforms.
T1  - Embedded computer systems :architectures, modeling, and simulation : 22nd International Conference, SAMOS 2022, Samos, Greece, July 3-7, 2022, proceedings /
AU  - Orailoglu, A.
AU  - Reichenbach, Marc,
AU  - Jung, Matthias
VL  - 13511
CN  - TK7895.E42
N1  - International conference proceedings.
N1  - Includes author index.
ID  - 1448759
KW  - Embedded computer systems
SN  - 9783031150746
SN  - 3031150740
TI  - Embedded computer systems :architectures, modeling, and simulation : 22nd International Conference, SAMOS 2022, Samos, Greece, July 3-7, 2022, proceedings /
LK  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-3-031-15074-6
UR  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-3-031-15074-6
ER  -