001451593 000__ 04425cam\a2200505\i\4500
001451593 001__ 1451593
001451593 003__ OCoLC
001451593 005__ 20230310004708.0
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001451593 008__ 221202s2022\\\\sz\a\\\\ob\\\\001\0\eng\d
001451593 019__ $$a1351202970$$a1351345111
001451593 020__ $$a9783031172076$$q(electronic bk.)
001451593 020__ $$a3031172078$$q(electronic bk.)
001451593 020__ $$z9783031172069
001451593 020__ $$z303117206X
001451593 0247_ $$a10.1007/978-3-031-17207-6$$2doi
001451593 035__ $$aSP(OCoLC)1352870171
001451593 040__ $$aGW5XE$$beng$$erda$$epn$$cGW5XE$$dYDX$$dEBLCP$$dOCLCQ$$dN$T$$dUKAHL
001451593 049__ $$aISEA
001451593 050_4 $$aTK5103.25
001451593 08204 $$a621.3845$$223/eng/20221202
001451593 1001_ $$aTong, Xingcun Colin,$$eauthor.$$1https://isni.org/isni/0000000063129136
001451593 24510 $$aAdvanced materials and components for 5G and beyond /$$cColin Tong.
001451593 264_1 $$aCham :$$bSpringer,$$c2022.
001451593 300__ $$a1 online resource :$$billustrations (color).
001451593 336__ $$atext$$btxt$$2rdacontent
001451593 337__ $$acomputer$$bc$$2rdamedia
001451593 338__ $$aonline resource$$bcr$$2rdacarrier
001451593 4901_ $$aSpringer series in materials science ;$$vvolume 327
001451593 504__ $$aIncludes bibliographical references and index.
001451593 5050_ $$aChapter 1. 5G technology components and material solutions for hardware system integration -- Chapter 2. Semiconductor solutions for 5G -- Chapter 3. Design and performance enhancement for 5G antennas and beamforming integrated circuits -- Chapter 4. PCB materials and design requirements for 5G systems -- Chapter 5. Materials for high frequency filters -- Chapter 6. EMI shielding materials and absorbers for 5G communications -- Chapter 7. Thermal management materials and components for 5G devices -- Chapter 8. Protective packaging and sealing materials for 5G mobile devices -- Chapter 9. Perspectives on 5G and beyond applications and related technologies.
001451593 506__ $$aAccess limited to authorized users.
001451593 520__ $$aThis book provides a comprehensive introduction to the current status and future trends of materials and component design for fifth-generation (5G) wireless communications and beyond. Necessitated by rapidly increasing numbers of mobile devices and data volumes, and acting as a driving force for innovation in information technology, 5G networks are broadly characterized by ubiquitous connectivity, extremely low latency, and very high-speed data transfer. Such capabilities are facilitated by nanoscale and massive multi-input multi-output (MIMO) with extreme base station and device densities, as well as unprecedented numbers of antennas. This book covers semiconductor solutions for 5G electronics, design and performance enhancement for 5G antennas, high frequency PCB materials and design requirements, materials for high frequency filters, EMI shielding materials and absorbers for 5G systems, thermal management materials and components, and protective packaging and sealing materials for 5G devices. It explores fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications of 5G-and-beyond wireless communications. Future challenges and potential trends of 5G-and-beyond applications and related materials technologies are also addressed. Throughout this book, illustrations clarify core concepts, techniques, and processes. At the end of each chapter, references serve as a gateway to the primary literature in the field. This book is essential reading for todays students, scientists, engineers and professionals who want to understand the current status and future trends in materials advancement and component design in 5G and beyond, and acquire skills for selecting and using materials and 5G component design that takes economic and regulatory aspects into account.
001451593 588__ $$aDescription based on print version record.
001451593 650_0 $$a5G mobile communication systems$$xEquipment and supplies.
001451593 655_0 $$aElectronic books.
001451593 77608 $$iPrint version:$$aTong, Xingcun Colin.$$tAdvanced materials and components for 5G and beyond.$$dCham : Springer Nature Switzerland, 2022$$z9783031172069$$w(OCoLC)1346942529
001451593 830_0 $$aSpringer series in materials science ;$$vv. 327.
001451593 852__ $$bebk
001451593 85640 $$3Springer Nature$$uhttps://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-3-031-17207-6$$zOnline Access$$91397441.1
001451593 909CO $$ooai:library.usi.edu:1451593$$pGLOBAL_SET
001451593 980__ $$aBIB
001451593 980__ $$aEBOOK
001451593 982__ $$aEbook
001451593 983__ $$aOnline
001451593 994__ $$a92$$bISE