TY  - GEN
N2  - This book systematically analyzes the applicability of big data analytics and Industry 4.0 from the perspective of semiconductor manufacturing management. It reports in real examples and presents case studies as supporting evidence. In recent years, technologies of big data analytics and Industry 4.0 have been frequently applied to the management of semiconductor manufacturing. However, related research results are mostly scattered in various journal issues or conference proceedings, and there is an urgent need for a systematic integration of these results. In addition, many related discussions have placed too much emphasis on the theoretical framework of information systems rather than on the needs of semiconductor manufacturing management. This book addresses these issues.
DO  - 10.1007/978-3-031-14065-5
DO  - doi
AB  - This book systematically analyzes the applicability of big data analytics and Industry 4.0 from the perspective of semiconductor manufacturing management. It reports in real examples and presents case studies as supporting evidence. In recent years, technologies of big data analytics and Industry 4.0 have been frequently applied to the management of semiconductor manufacturing. However, related research results are mostly scattered in various journal issues or conference proceedings, and there is an urgent need for a systematic integration of these results. In addition, many related discussions have placed too much emphasis on the theoretical framework of information systems rather than on the needs of semiconductor manufacturing management. This book addresses these issues.
T1  - Production planning and control in semiconductor manufacturing :big data analytics and Industry 4.0 applications /
AU  - Chen, Tin-Chih Toly,
CN  - HD9696.S42
ID  - 1452982
KW  - Semiconductor industry
KW  - Product coding
SN  - 9783031140655
SN  - 3031140656
TI  - Production planning and control in semiconductor manufacturing :big data analytics and Industry 4.0 applications /
LK  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-3-031-14065-5
UR  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-3-031-14065-5
ER  -