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More-than-Moore devices and integration for semiconductors / Francesca Iacopi, Francis Balestra, editors.
Iacopi, F. (Francesca), editor.; Balestra, Francis, editor.
2023
TK7835
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Title
More-than-Moore devices and integration for semiconductors / Francesca Iacopi, Francis Balestra, editors.
ISBN
9783031216107 (electronic bk.)
3031216105 (electronic bk.)
3031216091
9783031216091
DOI
https://doi.org/10.1007/978-3-031-21610-7
Published
Cham, Switzerland : Springer, 2023.
Language
English
Description
1 online resource (200 pages)
Item Number
10.1007/978-3-031-21610-7 doi
Call Number
TK7835
Dewey Decimal Classification
621.3815
Summary
This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.
Bibliography, etc. Note
Includes bibliographical references and index.
Access Note
Access limited to authorized users.
Source of Description
Description based on print version record.
Added Author
Iacopi, F. (Francesca), editor.
Balestra, Francis, editor.
Available in Other Form
MORE-THAN-MOORE DEVICES AND INTEGRATION FOR SEMICONDUCTORS.
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Introduction
TSV and interposers
Interconnects, including optical
Simulations and reliability
Sensors and cameras
Integrated power sources
Energy harvesters and power management
Flexible and wearable electronics
Photonics and/ or Antennas with metamaterials
Neuromorphic computing for IoT
Brain-computer interfaces.

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