Chiplet design and heterogeneous integration packaging / John H. Lau.
2023
TK7874
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Unlimited
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Can lend chapters, not whole ebooks
Details
Title
Chiplet design and heterogeneous integration packaging / John H. Lau.
Author
Lau, John H., author.
ISBN
9789811999178 (electronic bk.)
9811999171 (electronic bk.)
9789811999161
9811999163
9811999171 (electronic bk.)
9789811999161
9811999163
Published
Singapore : Springer, [2023]
Language
English
Description
1 online resource (xxii, 525 pages) : illustrations.
Other Standard Identifiers
10.1007/978-981-19-9917-8 doi
Call Number
TK7874
Dewey Decimal Classification
621.3815
Summary
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Bibliography, etc. Note
Includes bibliographical references (pages 509-517) and index.
Access Note
Access limited to authorized users.
Source of Description
Online resource; title from PDF title page (EBSCO, viewed April 7, 2023).
Available in Other Form
Print version: 9789811999161
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Table of Contents
State-of-the-Art of Advanced Packaging
Chip Partition and Chip Split
Multiple System and Heterogeneous Integration with TSV Interposers
Multiple System and Heterogeneous Integration with TSV-Less Interposers
Chiplets Lateral (Horizontal) Communications
Cu-Cu Hybrid Bonding.
Chip Partition and Chip Split
Multiple System and Heterogeneous Integration with TSV Interposers
Multiple System and Heterogeneous Integration with TSV-Less Interposers
Chiplets Lateral (Horizontal) Communications
Cu-Cu Hybrid Bonding.