TY  - GEN
N2  - The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
DO  - 10.1007/978-981-19-9917-8
DO  - doi
AB  - The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
T1  - Chiplet design and heterogeneous integration packaging /
AU  - Lau, John H.,
CN  - TK7874
ID  - 1462042
KW  - Integrated circuits
KW  - Microelectronic packaging.
SN  - 9789811999178
SN  - 9811999171
TI  - Chiplet design and heterogeneous integration packaging /
LK  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-981-19-9917-8
UR  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-981-19-9917-8
ER  -