001462042 000__ 03343cam\a2200589\i\4500
001462042 001__ 1462042
001462042 003__ OCoLC
001462042 005__ 20230503003423.0
001462042 006__ m\\\\\o\\d\\\\\\\\
001462042 007__ cr\un\nnnunnun
001462042 008__ 230406s2023\\\\si\a\\\\ob\\\\001\0\eng\d
001462042 019__ $$a1374243051$$a1374431206
001462042 020__ $$a9789811999178$$q(electronic bk.)
001462042 020__ $$a9811999171$$q(electronic bk.)
001462042 020__ $$z9789811999161
001462042 020__ $$z9811999163
001462042 0247_ $$a10.1007/978-981-19-9917-8$$2doi
001462042 035__ $$aSP(OCoLC)1375105316
001462042 040__ $$aN$T$$beng$$erda$$epn$$cN$T$$dN$T$$dGW5XE$$dYDX$$dEBLCP
001462042 049__ $$aISEA
001462042 050_4 $$aTK7874
001462042 08204 $$a621.3815$$223/eng/20230407
001462042 1001_ $$aLau, John H.,$$eauthor.
001462042 24510 $$aChiplet design and heterogeneous integration packaging /$$cJohn H. Lau.
001462042 264_1 $$aSingapore :$$bSpringer,$$c[2023]
001462042 300__ $$a1 online resource (xxii, 525 pages) :$$billustrations.
001462042 336__ $$atext$$btxt$$2rdacontent
001462042 337__ $$acomputer$$bc$$2rdamedia
001462042 338__ $$aonline resource$$bcr$$2rdacarrier
001462042 504__ $$aIncludes bibliographical references (pages 509-517) and index.
001462042 5050_ $$aState-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding.
001462042 506__ $$aAccess limited to authorized users.
001462042 520__ $$aThe book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
001462042 588__ $$aOnline resource; title from PDF title page (EBSCO, viewed April 7, 2023).
001462042 650_0 $$aIntegrated circuits$$xDesign and construction.
001462042 650_0 $$aMicroelectronic packaging.
001462042 655_0 $$aElectronic books.
001462042 77608 $$iPrint version: $$z9811999163$$z9789811999161$$w(OCoLC)1360305668
001462042 852__ $$bebk
001462042 85640 $$3Springer Nature$$uhttps://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-981-19-9917-8$$zOnline Access$$91397441.1
001462042 909CO $$ooai:library.usi.edu:1462042$$pGLOBAL_SET
001462042 980__ $$aBIB
001462042 980__ $$aEBOOK
001462042 982__ $$aEbook
001462042 983__ $$aOnline
001462042 994__ $$a92$$bISE