Chiplet design and heterogeneous integration packaging / John H. Lau.

Unlimited

Authorized users

Can lend chapters, not whole ebooks

Chiplet design and heterogeneous integration packaging / John H. Lau.

9789811999178 (electronic bk.)
9811999171 (electronic bk.)
9789811999161
9811999163

Singapore : Springer, [2023]

English

1 online resource (xxii, 525 pages) : illustrations.

10.1007/978-981-19-9917-8 doi

TK7874

621.3815

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Includes bibliographical references (pages 509-517) and index.

Access limited to authorized users.

Online resource; title from PDF title page (EBSCO, viewed April 7, 2023).

Print version: 9789811999161

Online Resources > Ebooks
All Resources