001463709 000__ 04101cam\a22006257a\4500 001463709 001__ 1463709 001463709 003__ OCoLC 001463709 005__ 20230601003333.0 001463709 006__ m\\\\\o\\d\\\\\\\\ 001463709 007__ cr\un\nnnunnun 001463709 008__ 230506s2023\\\\sz\\\\\\ob\\\\001\0\eng\d 001463709 019__ $$a1378095055 001463709 020__ $$a9783031267086$$q(electronic bk.) 001463709 020__ $$a3031267087$$q(electronic bk.) 001463709 020__ $$z3031267079 001463709 020__ $$z9783031267079 001463709 0247_ $$a10.1007/978-3-031-26708-6$$2doi 001463709 035__ $$aSP(OCoLC)1378389907 001463709 040__ $$aEBLCP$$beng$$cEBLCP$$dYDX$$dGW5XE$$dEBLCP 001463709 049__ $$aISEA 001463709 050_4 $$aTK7895.M4 001463709 08204 $$a621.39/7$$223/eng/20230509 001463709 1001_ $$aGan, Chong Leong. 001463709 24510 $$aInterconnect reliability in advanced memory device packaging /$$cChong Leong, Gan ยท Chen-Yu, Huang. 001463709 260__ $$aCham :$$bSpringer,$$c2023. 001463709 300__ $$a1 online resource (223 p.). 001463709 336__ $$atext$$btxt$$2rdacontent 001463709 337__ $$acomputer$$bc$$2rdamedia 001463709 338__ $$aonline resource$$bcr$$2rdacarrier 001463709 4901_ $$aSpringer Series in Reliability Engineering 001463709 504__ $$aIncludes bibliographical references and index. 001463709 5050_ $$aChapter 1: Advanced Memory and Device Packaging -- Chapter 2: Wearout Reliability-based Characterization in Memory Packaging -- Chapter 3: Recycling of Noble Metals Used in Memory Packaging -- Chapter 4: Advanced Flip Chip Packaging -- Chapter 5: Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD) -- Chapter 6: Specific Packaging Reliability Testing -- Chapter 7: Reliability Simulation and Modeling in Memory Packaging -- Chapter 8: Interconnects Reliability for Future Cryogenic Memory Applications. 001463709 506__ $$aAccess limited to authorized users. 001463709 520__ $$aThis book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry. 001463709 588__ $$aOnline resource; title from PDF title page (SpringerLink, viewed May 9, 2023). 001463709 650_0 $$aComputer storage devices$$xPackaging. 001463709 650_0 $$aInterconnects (Integrated circuit technology)$$xReliability. 001463709 655_0 $$aElectronic books. 001463709 7001_ $$aHuang, Chen-Yu. 001463709 77608 $$iPrint version:$$aGan, Chong Leong$$tInterconnect Reliability in Advanced Memory Device Packaging$$dCham : Springer International Publishing AG,c2023$$z9783031267079 001463709 830_0 $$aSpringer series in reliability engineering. 001463709 852__ $$bebk 001463709 85640 $$3Springer Nature$$uhttps://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-3-031-26708-6$$zOnline Access$$91397441.1 001463709 909CO $$ooai:library.usi.edu:1463709$$pGLOBAL_SET 001463709 980__ $$aBIB 001463709 980__ $$aEBOOK 001463709 982__ $$aEbook 001463709 983__ $$aOnline 001463709 994__ $$a92$$bISE