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Can lend chapters, not whole ebooks
Title
Interconnect reliability in advanced memory device packaging / Chong Leong, Gan · Chen-Yu, Huang.
ISBN
9783031267086 (electronic bk.)
3031267087 (electronic bk.)
3031267079
9783031267079
Imprint
Cham : Springer, 2023.
Language
English
Description
1 online resource (223 p.).
Other Standard Identifiers
10.1007/978-3-031-26708-6 doi
Call Number
TK7895.M4
Dewey Decimal Classification
621.39/7
Summary
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Bibliography, etc. Note
Includes bibliographical references and index.
Access Note
Access limited to authorized users.
Source of Description
Online resource; title from PDF title page (SpringerLink, viewed May 9, 2023).
Series
Springer series in reliability engineering.
Chapter 1: Advanced Memory and Device Packaging
Chapter 2: Wearout Reliability-based Characterization in Memory Packaging
Chapter 3: Recycling of Noble Metals Used in Memory Packaging
Chapter 4: Advanced Flip Chip Packaging
Chapter 5: Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD)
Chapter 6: Specific Packaging Reliability Testing
Chapter 7: Reliability Simulation and Modeling in Memory Packaging
Chapter 8: Interconnects Reliability for Future Cryogenic Memory Applications.
