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Can lend chapters, not whole ebooks
Title
Materials for advanced packaging / edited by Daniel Lu, C.P. Wong.
ISBN
9780387782195 (electronic bk.)
0387782192 (electronic bk.)
1281954268 (electronic bk.)
9781281954268 (electronic bk.)
3319450980
9783319450988
0387782184 (Cloth)
9780387782188 (hbk.)
6611954260
144194611X
038756988X
3319450972
Imprint
New York ; London : Springer, 2008.
Language
English
Description
1 online resource
Other Standard Identifiers
10.1007/978-0-387-78219-5 doi
Call Number
TK7874 .M38 2009eb
Dewey Decimal Classification
621.381046
Summary
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including: New bonding and joining techniques Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives. Materials and processing aspects on MEMS and wafer level chip scale packaging. Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering.
Bibliography, etc. Note
Includes bibliographical references and index.
Access Note
Access limited to authorized users.
Digital File Characteristics
text file
PDF
Source of Description
Description based on print version record.
Materials for 3D Packages
Materials for Advanced Bonding/ Joining Techniques
Materials for Advanced Interconnections
Lead-Free Solders
Materials for Wafer Processing (such as thinning)
Materials for Advanced Substrates (such as thin core or coreless substrates)
Materials for Advanced Underfill and Encapsulant
Adhesives (ECA, Nano-ECA, Die Attach Adhesive)
Advanced Thermal Interface Materials
Materials for Embedded Passives
Nanomaterials/ Nanopackaging
Wafer Level Packaging
MEMS Packaging
Optical Packaging
Digital Health and Biomedical Packaging.
