TY  - GEN
N2  - Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including: New bonding and joining techniques Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives. Materials and processing aspects on MEMS and wafer level chip scale packaging. Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering.
DO  - 10.1007/978-0-387-78219-5
DO  - doi
AB  - Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including: New bonding and joining techniques Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives. Materials and processing aspects on MEMS and wafer level chip scale packaging. Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering.
T1  - Materials for advanced packaging /
DA  - 2008.
CY  - New York ;
CY  - London :
AU  - Lu, Daniel.
AU  - Wong, C. P.,
CN  - TK7874
PB  - Springer,
PP  - New York ;
PP  - London :
PY  - 2008.
ID  - 1467657
KW  - Packaging
KW  - Microelectronic packaging.
KW  - Conditionnement (Emballage)
KW  - Mise sous boîtier (Microélectronique)
SN  - 9780387782195
SN  - 0387782192
SN  - 1281954268
SN  - 9781281954268
SN  - 3319450980
SN  - 9783319450988
TI  - Materials for advanced packaging /
LK  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-3-319-45098-8
UR  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-3-319-45098-8
ER  -