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001467657 001__ 1467657
001467657 003__ OCoLC
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001467657 008__ 090311s2008\\\\nyu\\\\\ob\\\\001\0\eng\d
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001467657 020__ $$a9781281954268$$q(electronic bk.)
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001467657 0247_ $$a10.1007/978-0-387-78219-5$$2doi
001467657 035__ $$aSP(OCoLC)314183008
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001467657 049__ $$aISEA
001467657 050_4 $$aTK7874$$b.M38 2009eb
001467657 08204 $$a621.381046$$222
001467657 24500 $$aMaterials for advanced packaging /$$cedited by Daniel Lu, C.P. Wong.
001467657 260__ $$aNew York ;$$aLondon :$$bSpringer,$$c2008.
001467657 300__ $$a1 online resource
001467657 336__ $$atext$$btxt$$2rdacontent
001467657 337__ $$acomputer$$bc$$2rdamedia
001467657 338__ $$aonline resource$$bcr$$2rdacarrier
001467657 347__ $$atext file
001467657 347__ $$bPDF
001467657 504__ $$aIncludes bibliographical references and index.
001467657 5050_ $$aMaterials for 3D Packages -- Materials for Advanced Bonding/ Joining Techniques -- Materials for Advanced Interconnections -- Lead-Free Solders -- Materials for Wafer Processing (such as thinning) -- Materials for Advanced Substrates (such as thin core or coreless substrates) -- Materials for Advanced Underfill and Encapsulant -- Adhesives (ECA, Nano-ECA, Die Attach Adhesive) -- Advanced Thermal Interface Materials -- Materials for Embedded Passives -- Nanomaterials/ Nanopackaging -- Wafer Level Packaging -- MEMS Packaging -- Optical Packaging -- Digital Health and Biomedical Packaging.
001467657 506__ $$aAccess limited to authorized users.
001467657 520__ $$aSignificant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including: New bonding and joining techniques Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives. Materials and processing aspects on MEMS and wafer level chip scale packaging. Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering.
001467657 588__ $$aDescription based on print version record.
001467657 650_0 $$aPackaging$$xMaterials.
001467657 650_0 $$aMicroelectronic packaging.
001467657 650_6 $$aConditionnement (Emballage)$$xMatériaux.
001467657 650_6 $$aMise sous boîtier (Microélectronique)
001467657 655_0 $$aElectronic books.
001467657 7001_ $$aLu, Daniel.
001467657 7001_ $$aWong, C. P.,$$d1947-
001467657 77608 $$iPrint version:$$tMaterials for advanced packaging.$$dNew York ; London : Springer, 2008$$z9780387782188$$z0387782184$$w(OCoLC)213479612
001467657 852__ $$bebk
001467657 85640 $$3Springer Nature$$uhttps://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-3-319-45098-8$$zOnline Access$$91397441.1
001467657 909CO $$ooai:library.usi.edu:1467657$$pGLOBAL_SET
001467657 980__ $$aBIB
001467657 980__ $$aEBOOK
001467657 982__ $$aEbook
001467657 983__ $$aOnline
001467657 994__ $$a92$$bISE