TY  - GEN
N2  - The book presents high-quality papers from the Sixth International Conference on Microelectronics and Telecommunication Engineering (ICMETE 2022). It discusses the latest technological trends and advances in major research areas such as microelectronics, wireless communications, optical communication, signal processing, image processing, big data, cloud computing, artificial intelligence, and sensor network applications. This book includes the contributions of national and international scientists, researchers, and engineers from both academia and the industry. The contents of this book are useful to researchers, professionals, and students alike. .
DO  - 10.1007/978-981-19-9512-5
DO  - doi
AB  - The book presents high-quality papers from the Sixth International Conference on Microelectronics and Telecommunication Engineering (ICMETE 2022). It discusses the latest technological trends and advances in major research areas such as microelectronics, wireless communications, optical communication, signal processing, image processing, big data, cloud computing, artificial intelligence, and sensor network applications. This book includes the contributions of national and international scientists, researchers, and engineers from both academia and the industry. The contents of this book are useful to researchers, professionals, and students alike. .
T1  - Micro-electronics and telecommunication engineering :proceedings of 6th ICMETE 2022 /
AU  - Sharma, Devendra Kumar,
AU  - Peng, Sheng-Lung,
AU  - Sharma, Rohit
AU  - Jeon, Gwanggil,
VL  - volume 617
CN  - TK7874
N1  - Includes index.
ID  - 1469714
KW  - Microelectronics
KW  - Telecommunication
SN  - 9789811995125
SN  - 9811995125
TI  - Micro-electronics and telecommunication engineering :proceedings of 6th ICMETE 2022 /
LK  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-981-19-9512-5
UR  - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-981-19-9512-5
ER  -