Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium :: EPITS 2022, 14-15 September, Langkawi, Malaysia /: Mohd Arif Anuar Mohd Salleh, Dewi Suriyani Che Halin, Kamrosni Abdul Razak, Mohd Izrul Izwan Ramli, editors.

Mohd Arif Anuar Mohd Salleh,; Che Halin, Dewi Suriyani,; Abdul Razak, Kamrosni,; Ramli, Mohd Izrul Izwan,

doi:10.1007/978-981-19-9267-4

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium : EPITS 2022, 14-15 September, Langkawi, Malaysia / Mohd Arif Anuar Mohd Salleh, Dewi Suriyani Che Halin, Kamrosni Abdul Razak, Mohd Izrul Izwan Ramli, editors.

Electronic Packaging Interconnect Technology Symposium (2022 : Kuah, Kedah, Malaysia); Mohd Arif Anuar Mohd Salleh, editor.; Che Halin, Dewi Suriyani, editor.; Abdul Razak, Kamrosni, editor.; Ramli, Mohd Izrul Izwan, editor.

2023

TK7870.15

Available Online

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Title

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium : EPITS 2022, 14-15 September, Langkawi, Malaysia / Mohd Arif Anuar Mohd Salleh, Dewi Suriyani Che Halin, Kamrosni Abdul Razak, Mohd Izrul Izwan Ramli, editors.

Meeting Name

Electronic Packaging Interconnect Technology Symposium (2022 : Kuah, Kedah, Malaysia)

ISBN

9789811992674 (electronic bk.)
9811992673 (electronic bk.)
9789811992667
9811992665

DOI

https://doi.org/10.1007/978-981-19-9267-4

Published

Singapore : Springer, 2023.

Language

English

Description

1 online resource (xli, 875 pages) : illustrations (some color).

Item Number

10.1007/978-981-19-9267-4 doi

Call Number

TK7870.15

Dewey Decimal Classification

621.381/046

Summary

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.

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Access limited to authorized users.

Source of Description

Online resource; title from PDF title page (SpringerLink, viewed July 5, 2023).

Added Author

Mohd Arif Anuar Mohd Salleh, editor.
Che Halin, Dewi Suriyani, editor.
Abdul Razak, Kamrosni, editor.
Ramli, Mohd Izrul Izwan, editor.

Series

Springer proceedings in physics ; v. 289.

Available in Other Form

Print version: 9789811992667

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