TY - GEN AB - This book constitutes the proceedings of the 22nd International Conference on Computer Information Systems and Industrial Management, CISIM 2023, held in Tokio, Japan, during September 22-24, 2023. The 36 papers presented in this book were carefully reviewed and selected from 77 submissions. They were organized in topical sections as follows: biometrics and pattern recognition applications; computer information systems and security; industrial management and other applications; machine learning and artificial neural networks; modelling and optimization; wellbeing and affective engineering; and machine learning using biometric data and kansei data. AU - Saeed, Khalid AU - Dvorský, Jiří AU - Nishiuchi, Nobuyuki, AU - Fukumoto, Makoto, CN - TK5105.5 DO - 10.1007/978-3-031-42823-4 DO - doi ID - 1480952 KW - Réseaux d'ordinateurs KW - Réseaux d'ordinateurs KW - Bases de données KW - Computer networks KW - Computer networks KW - Database management LK - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-3-031-42823-4 N1 - Includes author index. N2 - This book constitutes the proceedings of the 22nd International Conference on Computer Information Systems and Industrial Management, CISIM 2023, held in Tokio, Japan, during September 22-24, 2023. The 36 papers presented in this book were carefully reviewed and selected from 77 submissions. They were organized in topical sections as follows: biometrics and pattern recognition applications; computer information systems and security; industrial management and other applications; machine learning and artificial neural networks; modelling and optimization; wellbeing and affective engineering; and machine learning using biometric data and kansei data. SN - 9783031428234 SN - 3031428234 T1 - Computer information systems and industrial management :22nd International Conference, CISIM 2023, Tokyo, Japan, September 22-24, 2023, Proceedings / TI - Computer information systems and industrial management :22nd International Conference, CISIM 2023, Tokyo, Japan, September 22-24, 2023, Proceedings / UR - https://univsouthin.idm.oclc.org/login?url=https://link.springer.com/10.1007/978-3-031-42823-4 VL - 14164 ER -