TY  - GEN
DO  - 10.1002/9781394188826
DO  - doi
T1  - Polymeric materials for electronic packaging /
AU  - Nakamura, Shozo
CN  - QD382.C66
ID  - 1492018
KW  - Conducting polymers.
KW  - Electronic packaging.
SN  - 9781394188826
SN  - 139418882X
SN  - 9781394188819
SN  - 1394188811
SN  - 9781394188802
SN  - 1394188803
TI  - Polymeric materials for electronic packaging /
LK  - https://univsouthin.idm.oclc.org/login?url=https://ebookcentral.proquest.com/lib/usiricelib-ebooks/detail.action?docID=30723428
UR  - https://univsouthin.idm.oclc.org/login?url=https://ebookcentral.proquest.com/lib/usiricelib-ebooks/detail.action?docID=30723428
ER  -