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Table of Contents
Intro
Contents
Preface
Acknowledgments
About the authors
1. Advanced semiconductor electronic packaging
2. Warpage evolution of TSV wafer based on a hierarchy multiscale analysis method
3. Investigation on fatigue life of solder joints for 2.5D packaging structures
4. Molding process simulation of substrates
5. Structural integration simulation under vibration for PBGA packaging
6. Electromigration simulation study of copper interconnects in 3D packaging
7. Study on the influence of mechanical properties of TSV-Cu on cracking in TSV/RDL interconnect structures
8. Mechanical response of solder joints under drop impact loads
Index
Contents
Preface
Acknowledgments
About the authors
1. Advanced semiconductor electronic packaging
2. Warpage evolution of TSV wafer based on a hierarchy multiscale analysis method
3. Investigation on fatigue life of solder joints for 2.5D packaging structures
4. Molding process simulation of substrates
5. Structural integration simulation under vibration for PBGA packaging
6. Electromigration simulation study of copper interconnects in 3D packaging
7. Study on the influence of mechanical properties of TSV-Cu on cracking in TSV/RDL interconnect structures
8. Mechanical response of solder joints under drop impact loads
Index