Printed wiring board industry and use cluster profile [microform].
1995
EP 5.2: P 93
Available at Government Documents Microfiche
Items
Details
Title
Printed wiring board industry and use cluster profile [microform].
Publication Details
Washington, DC : Design for the Environment Program, Economics, Exposure, and Technology Division, Office of Pollution Prevention and Toxics, U.S. Environmental Protection Agency, [1995]
Language
English
Description
1 v. (various pagings) : ill. ; 28 cm.
Call Number
EP 5.2: P 93
GPO Item No.
0473-B-01 (MF)
Note
"Design for the Environment printed wiring board project"--Cover.
"Prepared by Microelectronics and Computer Technology Corporation and the Institute for Interconnecting and Packaging Electronic Circuits"--1st prelim. p.
Shipping list no.: 97-0792-M.
"September 1995"--Cover.
"This document was produced under grant #X 823856-01-0 from EPA's Environmental Technology Initiative program."
"EPA 744-R-95-005"--Cover.
"Prepared by Microelectronics and Computer Technology Corporation and the Institute for Interconnecting and Packaging Electronic Circuits"--1st prelim. p.
Shipping list no.: 97-0792-M.
"September 1995"--Cover.
"This document was produced under grant #X 823856-01-0 from EPA's Environmental Technology Initiative program."
"EPA 744-R-95-005"--Cover.
Bibliography, etc. Note
Includes bibliographical references.
Reproduction
Microfiche. [Washington, D.C.] : Supt. of Docs., U.S. G.P.O., [1997] 1 microfiche : negative.
Added Corporate Author
Design for the Environment Program (U.S.)
Microelectronics and Computer Technology Corporation.
Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)
Microelectronics and Computer Technology Corporation.
Institute for Interconnecting and Packaging Electronic Circuits (Northbrook, Ill.)
Series
Design for the environment
Record Appears in
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