@article{356742,
      author = {Bailey, Christopher. and Liu, Johan.},
      url = {http://library.usi.edu/record/356742},
      title = {Advanced manufacturing process, lead free interconnect  materials and reliability modeling for electronics  packaging [electronic resource] /},
      publisher = {Emerald Group Publishing,},
      recid = {356742},
      pages = {72 p.},
      address = {Bradford, England :},
      year = {2006},
}