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000393898 010__ $$z   90060385 
000393898 020__ $$z030904233X
000393898 035__ $$a(CaPaEBR)ebr10060398
000393898 035__ $$a(OCoLC)646716913
000393898 040__ $$aCaPaEBR$$cCaPaEBR
000393898 05014 $$aTK7870.15$$b.N38 1990eb
000393898 08204 $$a621.381/046$$220
000393898 1102_ $$aNational Research Council (U.S.).$$bCommittee on Materials for High-Density Electronic Packaging.
000393898 24510 $$aMaterials for high-density electronic packaging and interconnection$$h[electronic resource] :$$breport of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
000393898 260__ $$aWashington, D.C. :$$bNational Academy Press ;$$aAlexandria, VA :$$bAvailable from Defense Technical Information Center, Cameron Station,$$c1990.
000393898 300__ $$axiv, 139 p. :$$bill.
000393898 500__ $$a"NMAB-449."
000393898 504__ $$aIncludes bibliographical references.
000393898 506__ $$aAccess limited to authorized users.
000393898 650_0 $$aElectronic packaging$$xMaterials.
000393898 650_0 $$aElectrical engineering$$xMaterials.
000393898 655_7 $$aElectronic books.$$2lcsh
000393898 85280 $$bebk$$hProquest Ebook Central Academic Complete
000393898 85640 $$3ProQuest Ebook Central Academic Complete$$uhttps://univsouthin.idm.oclc.org/login?url=http://site.ebrary.com/lib/usiricelib/Doc?id=10060398$$zOnline Access
000393898 909CO $$ooai:library.usi.edu:393898$$pGLOBAL_SET
000393898 980__ $$aEBOOK
000393898 980__ $$aBIB
000393898 982__ $$aEbook
000393898 983__ $$aOnline