TY  - GEN
T1  - Lead-free solder interconnect reliability
DA  - 2005.
CY  - Materials Park, OH :
AU  - Shangguan, Dongkai,
CN  - TK7870.15
PB  - ASM International,
PP  - Materials Park, OH :
PY  - 2005.
ID  - 410316
KW  - Microelectronic packaging
KW  - Solder and soldering.
KW  - Lead-free electronics manufacturing processes.
TI  - Lead-free solder interconnect reliability
LK  - https://univsouthin.idm.oclc.org/login?url=http://site.ebrary.com/lib/usiricelib/Doc?id=10320384
UR  - https://univsouthin.idm.oclc.org/login?url=http://site.ebrary.com/lib/usiricelib/Doc?id=10320384
ER  -