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000410316 010__ $$z  2005050106
000410316 020__ $$z0871708167
000410316 035__ $$a(CaPaEBR)ebr10320384
000410316 035__ $$a(OCoLC)297986526
000410316 040__ $$aCaPaEBR$$cCaPaEBR
000410316 05014 $$aTK7870.15$$b.L425 2005eb
000410316 08204 $$a621.381/046$$222
000410316 24500 $$aLead-free solder interconnect reliability$$h[electronic resource] /$$cedited by Dongkai Shangguan.
000410316 260__ $$aMaterials Park, OH :$$bASM International,$$c2005.
000410316 300__ $$ax, 292 p. :$$bill. ;$$c26 cm.
000410316 504__ $$aIncludes bibliographical references and index.
000410316 506__ $$aAccess limited to authorized users.
000410316 650_0 $$aMicroelectronic packaging$$xReliability.
000410316 650_0 $$aSolder and soldering.
000410316 650_0 $$aLead-free electronics manufacturing processes.
000410316 655_7 $$aElectronic books.$$2lcsh
000410316 7001_ $$aShangguan, Dongkai,$$d1963-
000410316 852__ $$bebk
000410316 85640 $$3ProQuest Ebook Central Academic Complete$$uhttps://univsouthin.idm.oclc.org/login?url=http://site.ebrary.com/lib/usiricelib/Doc?id=10320384$$zOnline Access
000410316 909CO $$ooai:library.usi.edu:410316$$pGLOBAL_SET
000410316 980__ $$aEBOOK
000410316 980__ $$aBIB
000410316 982__ $$aEbook
000410316 983__ $$aOnline