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000419567 010__ $$z   95070760 
000419567 020__ $$z0309053358
000419567 035__ $$a(CaPaEBR)ebr10056927
000419567 035__ $$a(OCoLC)647366888
000419567 040__ $$aCaPaEBR$$cCaPaEBR
000419567 05014 $$aTK7871.85$$b.M3679 1995eb
000419567 24500 $$aMaterials for high-temperature semiconductor devices$$h[electronic resource] /$$cCommittee on Materials for High-Temperature Semiconductor Devices, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
000419567 260__ $$aWashington, D.C. :$$bNational Academy Press,$$cc1995.
000419567 300__ $$axv, 119 p. :$$bill. ;$$c28 cm.
000419567 500__ $$a"NMAB-474."
000419567 504__ $$aIncludes bibliographical references.
000419567 506__ $$aAccess limited to authorized users.
000419567 650_0 $$aSemiconductors.
000419567 650_0 $$aMaterials at high temperatures.
000419567 650_0 $$aWide gap semiconductors.
000419567 655_7 $$aElectronic books.$$2lcsh
000419567 852__ $$bebk
000419567 85640 $$3ProQuest Ebook Central Academic Complete$$uhttps://univsouthin.idm.oclc.org/login?url=http://site.ebrary.com/lib/usiricelib/Doc?id=10056927$$zOnline Access
000419567 909CO $$ooai:library.usi.edu:419567$$pGLOBAL_SET
000419567 980__ $$aEBOOK
000419567 980__ $$aBIB
000419567 982__ $$aEbook
000419567 983__ $$aOnline