TY  - GEN
N2  - "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
AB  - "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
T1  - Modeling and simulation for microelectronic packaging assemblymanufacturing, reliability and testing /
DA  - 2011.
CY  - Hoboken, N.J. :
AU  - Liu, S.
AU  - Liu, Yong,
CN  - Proquest Ebook Central Academic Complete
CN  - TK7870.15
PB  - Wiley,
PP  - Hoboken, N.J. :
PY  - 2011.
ID  - 442184
KW  - Microelectronic packaging
KW  - Electronic books.
SN  - 9780470827819 (electronic bk.)
TI  - Modeling and simulation for microelectronic packaging assemblymanufacturing, reliability and testing /
LK  - https://univsouthin.idm.oclc.org/login?url=http://site.ebrary.com/lib/usiricelib/Doc?id=10494525
UR  - https://univsouthin.idm.oclc.org/login?url=http://site.ebrary.com/lib/usiricelib/Doc?id=10494525
ER  -