Modeling and simulation for microelectronic packaging assembly: [electronic resource] :: manufacturing, reliability and testing /: Sheng Liu, Yong Liu.

Name: Modeling and simulation for microelectronic packaging assembly [electronic resource] : manufacturing, reliability and testing / Sheng Liu, Yong Liu.
ISBN: 9780470827819 (electronic bk.)

Liu, S.; Liu, Yong,

Modeling and simulation for microelectronic packaging assembly [electronic resource] : manufacturing, reliability and testing / Sheng Liu, Yong Liu.

Liu, S. (Sheng), 1963-; Liu, Yong, 1962-

2011

TK7870.15 .L58 2011eb

Available Online

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Title

Modeling and simulation for microelectronic packaging assembly [electronic resource] : manufacturing, reliability and testing / Sheng Liu, Yong Liu.

Author

Liu, S. (Sheng), 1963-

ISBN

9780470827802 (hardback)
9780470827826 (oBook)
9780470828410 (ePub)
9781118082829 (Mobi)
9780470827819 (electronic bk.)

Publication Details

Hoboken, N.J. : Wiley, 2011.

Language

English

Description

1 online resource (xxii, 564 p.) : ill.

Call Number

TK7870.15 .L58 2011eb

Dewey Decimal Classification

621.381/046

Summary

"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- Provided by publisher.

Bibliography, etc. Note

Includes bibliographical references and index.

Access Note

Access limited to authorized users.

Added Author

Liu, Yong, 1962-

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