TY  - GEN
N2  - "This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--
AB  - "This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--
T1  - LED packaging for lighting applicationsdesign, manufacturing, and testing /
DA  - 2011.
CY  - Hoboken, N.J. :
AU  - Liu, S.
AU  - Luo, Xiaobing,
CN  - TK7871.89.L53
PB  - Wiley,
PP  - Hoboken, N.J. :
PY  - 2011.
ID  - 444461
KW  - Light emitting diodes
KW  - Light emitting diodes
KW  - Electronic packaging.
KW  - Electric lighting
TI  - LED packaging for lighting applicationsdesign, manufacturing, and testing /
LK  - https://univsouthin.idm.oclc.org/login?url=http://site.ebrary.com/lib/usiricelib/Doc?id=10490643
UR  - https://univsouthin.idm.oclc.org/login?url=http://site.ebrary.com/lib/usiricelib/Doc?id=10490643
ER  -