000445364 000__ 01556cam\a2200337\a\4500
000445364 001__ 445364
000445364 005__ 20210513154309.0
000445364 006__ m\\\\\\\\u\\\\\\\\
000445364 007__ cr\cn|||||||||
000445364 008__ 120330s2011\\\\ohua\\\\sb\\\\101\0\eng\d
000445364 020__ $$z0615038263
000445364 020__ $$z9781615038268
000445364 020__ $$z9781615038503 (e-book)
000445364 035__ $$a(CaPaEBR)ebr10540844
000445364 035__ $$a(OCoLC)787848235
000445364 040__ $$aCaPaEBR$$cCaPaEBR
000445364 05014 $$aTK7871$$b.I58 2011eb
000445364 1112_ $$aInternational Symposium for Testing and Failure Analysis$$n(37th :$$d2011 :$$cSan Jose, Calif.)
000445364 24510 $$aISTFA 2011$$h[electronic resource] :$$bconference proceedings of the 37th International Symposium for Testing and Failure Analysis : November 13-17, 2011, San Jose Convention Center, San Jose, California, USA /$$csponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2009, ASM International.
000445364 260__ $$aMaterials Park, Ohio :$$bASM International,$$c2011.
000445364 300__ $$axix, 456 p. :$$bcol. ill.
000445364 504__ $$aIncludes bibliographical references and index.
000445364 506__ $$aAccess limited to authorized users.
000445364 650_0 $$aElectronics$$xMaterials$$xTesting$$vCongresses.
000445364 650_0 $$aElectronic apparatus and appliances$$xTesting$$vCongresses.
000445364 655_7 $$aElectronic books.$$2lcsh
000445364 7102_ $$aASM International.
000445364 7102_ $$aElectronic Device Failure Analysis Society.
000445364 85280 $$bebk$$hProquest Ebook Central Academic Complete
000445364 85640 $$3ProQuest Ebook Central Academic Complete$$uhttps://univsouthin.idm.oclc.org/login?url=http://site.ebrary.com/lib/usiricelib/Doc?id=10540844$$zOnline Access
000445364 909CO $$ooai:library.usi.edu:445364$$pGLOBAL_SET
000445364 980__ $$aEBOOK
000445364 980__ $$aBIB
000445364 982__ $$aEbook
000445364 983__ $$aOnline