Semiconductor packaging [electronic resource] : materials interaction and reliability / Andrea Chen, Randy Hsiao-Yu Lo.
Chen, Andrea.; Lo, Randy.
2012
TK7870.15 .C54 2012eb
Available Online

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Title Semiconductor packaging [electronic resource] : materials interaction and reliability / Andrea Chen, Randy Hsiao-Yu Lo.
Author Chen, Andrea.
ISBN 9781439862070 (electronic bk.)
1439862079 (electronic bk.)
Publication Details Boca Raton, Fla. : CRC Press, 2012.
Language English
Description 1 online resource (xviii, 198 p.) : ill.
Call Number TK7870.15 .C54 2012eb
Dewey Decimal Classification 621.38152
Summary "In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world"-- Provided by publisher.
Bibliography, etc. Note Includes bibliographical references and index.
Access Note Access limited to authorized users.
Source of Description Description based on print version record.
Added Author Lo, Randy.
Available in Other Form Semiconductor packaging.
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Record Appears in Online Resources > Ebooks
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Semiconductor packages
Package reliability
Materials used in semiconductor packaging
The future.

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