Handbook of wafer bonding [electronic resource] / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo.
2012
TK7871.85 .H36 2012eb
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Details
Title
Handbook of wafer bonding [electronic resource] / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo.
ISBN
9783527326464
9783527644247 (e-book)
9783527644247 (e-book)
Publication Details
Weinheim, Germany : Wiley-VCH, 2012.
Language
English
Description
xxxi, 395 p. : col. ill.
Call Number
TK7871.85 .H36 2012eb
Bibliography, etc. Note
Includes bibliographical references and index.
Access Note
Access limited to authorized users.
Added Author
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Table of Contents
pt. 1. Technologies
pt. 2. Applications.
pt. 2. Applications.